Advanced Ceramic X
HI0603-1B1N5SHT
Ind RF Chip Multi-Layer 1.5nH 0.3nH 100MHz 4Q-Factor Ceramic 300mA 0201 T/R
Package0201
Inductance1.5nH
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Technical Specifications
Advanced Ceramic X HI0603-1B1N5SHT technical specifications.
General
| Package/Case | 0201 |
| Core Material | Ceramic |
| Depth | 0.33mm |
| Height | 0.33mm |
| Inductance | 1.5nH |
| Max DC Current | 300mA |
| Radiation Hardening | No |
Compliance
| RoHS | Compliant |
Datasheet
Advanced Ceramic X HI0603-1B1N5SHT Datasheet
Download the complete datasheet for Advanced Ceramic X HI0603-1B1N5SHT to view detailed technical specifications.
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