Advanced Ceramic X
HI0603-1B3N3SHT
Ind RF Chip Multi-Layer 3.3nH 0.3nH 100MHz 4Q-Factor Ceramic 300mA 0201 T/R
Package0201
Inductance3.3nH
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Technical Specifications
Advanced Ceramic X HI0603-1B3N3SHT technical specifications.
General
Package/Case
0201
Core Material
Ceramic
Depth
0.33mm
Height
0.33mm
Inductance
3.3nH
Max DC Current
300mA
Radiation Hardening
No
Compliance
RoHS
Compliant
Datasheet
Advanced Ceramic X HI0603-1B3N3SHT Datasheet
Download the complete datasheet for Advanced Ceramic X HI0603-1B3N3SHT to view detailed technical specifications.
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