Advanced Ceramic X
HI1005-1C1N0SMT
Ind RF Chip Multi-Layer 1nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R
Package0402
Inductance1nH
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Technical Specifications
Advanced Ceramic X HI1005-1C1N0SMT technical specifications.
General
| Package/Case | 0402 |
| Core Material | Ceramic |
| Depth | 0.6mm |
| Height | 0.6mm |
| Inductance | 1nH |
| Max DC Current | 300mA |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Advanced Ceramic X HI1005-1C1N0SMT Datasheet
Download the complete datasheet for Advanced Ceramic X HI1005-1C1N0SMT to view detailed technical specifications.
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