
SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy. SAC305 is widely used in hand, selective, wave and SMT soldering. SAC305 provides durable joint strength and the lowest melting point of tin/silver/copper solders. SAC305 alloy is available in solder wire, solder bar, and solder paste.
AIM Solder SAC305 technical specifications.
| Form | Bar|Paste|Wire |
| Alloy Composition | Sn96.5Ag3.0Cu0.5 |
| Liquidus Temperature | 220°C |
| Liquidus Temperature | 428°F |
| Solidus Temperature | 217°C |
| Solidus Temperature | 423°F |
| Composition | 96.5% Tin (Sn) |
| Composition | 3.0% Silver (Ag) |
| Composition | 0.5% Copper (Cu) |
| Shelf Life | Indefinite |
| Storage Temperature | RoomTemperature |
| Weight | 1.1kg |
| Weight | 2.5lb |
| Form Factor | Triangular Bars |
| Form Factor | Hanging Safety Bar |
| Form Factor | Solid Wire |
| Form Factor | Flux Cored Wire |
| Form Factor | Solder Pastes |
| EU RoHS | Yes |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| REACH | Compliant |
| Jeida | Compliant |
| Standard | IPC J-STD-006 |
Download the complete datasheet for AIM Solder SAC305 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.