The M55302/58-A66Y-64 is a 66-contact RCP wire to board header from Airborn. It features a straight body orientation and is designed for panel mount applications. The header has a terminal pitch of 1.27mm and a termination method of solder cup. It can operate within a temperature range of -65 to 125°C and has a maximum current rating of 5A.
MountingPanel Mount
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Technical Specifications
Airborn M55302/58-A66Y-64 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 66 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder Cup |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Panel Mount |
| Max Current Rating | 5A |
| Height | 6.35mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58-A66Y-64 Datasheet
Download the complete datasheet for Airborn M55302/58-A66Y-64 to view detailed technical specifications.
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