Airborn
M55302/58-H30Y-50
30-Contact RCP Wire to Board Header, 1.27mm Pitch, 2 Rows, Through Hole Mount
The M55302/58-H30Y-50 is a 30-contact wire to board header from Airborn, featuring a right-angle contact position and a 1.27mm terminal pitch. It is designed for use in applications where a high number of connections are required, and is suitable for operating temperatures ranging from -65 to 125 degrees Celsius. The header is available in a through hole package and is rated for a maximum current of 5A. It is ideal for use in a variety of industries, including aerospace and industrial automation.
MountingThrough Hole
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Technical Specifications
Airborn M55302/58-H30Y-50 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 30 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58-H30Y-50 Datasheet
Download the complete datasheet for Airborn M55302/58-H30Y-50 to view detailed technical specifications.
No datasheet is available for this part.