Airborn
M55302/58LB60Y-27
60-Contact RCP Wire to Board Header, 2 Rows, 1.27mm Pitch, Through Hole Mount
The M55302/58LB60Y-27 is a 60-contact wire to board header from Airborn, designed for through hole mounting. It features a straight body orientation and a terminal pitch of 1.27mm. The header operates within a temperature range of -65°C to 125°C and has a maximum current rating of 5A. The 60-contact RCP header is suitable for use in applications requiring a reliable and efficient connection.
MountingThrough Hole
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Technical Specifications
Airborn M55302/58LB60Y-27 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 60 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58LB60Y-27 Datasheet
Download the complete datasheet for Airborn M55302/58LB60Y-27 to view detailed technical specifications.
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