The M55302/63B70F is a 70-contact PL wire-to-board header from Airborn, designed for through hole mounting. It features a 1.27mm terminal pitch and a straight body orientation. The header operates within a temperature range of -65°C to 125°C and has a maximum current rating of 5A. The M55302/63B70F is suitable for use in applications where a reliable and compact connection is required.
MountingThrough Hole
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Technical Specifications
Airborn M55302/63B70F technical specifications.
General
| Type | Wire to Board |
| Gender | PL |
| Number of Contacts | 70 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 12.31mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/63B70F Datasheet
Download the complete datasheet for Airborn M55302/63B70F to view detailed technical specifications.
No datasheet is available for this part.