The M55302/64-B26Y-25 is a 26-contact RCP wire-to-board header from Airborn with a terminal pitch of 1.27mm. It features a straight body orientation and is designed for through-hole mounting. The header operates within a temperature range of -65 to 125 degrees Celsius and has a maximum current rating of 5A. The M55302/64-B26Y-25 is suitable for use in applications requiring a reliable and efficient connection between boards.
MountingThrough Hole
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Technical Specifications
Airborn M55302/64-B26Y-25 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 26 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/64-B26Y-25 Datasheet
Download the complete datasheet for Airborn M55302/64-B26Y-25 to view detailed technical specifications.
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