The M55302/64-F70Y-63 is a 70-contact RCP wire to board header from Airborn. It features a 1.27mm terminal pitch and is designed for wire wrap termination. The header has a maximum operating temperature range of -65°C to 125°C and a maximum current rating of 5A. It is available in a through hole package with a height of 11.81mm.
MountingThrough Hole
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Technical Specifications
Airborn M55302/64-F70Y-63 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 70 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/64-F70Y-63 Datasheet
Download the complete datasheet for Airborn M55302/64-F70Y-63 to view detailed technical specifications.
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