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Technical Specifications
Amphenol 10033854-252TSLF technical specifications.
General
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 25.2mm |
| Insulation Material | Polymer |
| Length | 72.2mm |
| Memory Type | DDR2 SDRAM, |
| Mount | Surface Mount, Reverse |
| Number of Contacts | 200 |
| Number of Positions | 200 |
| Number of Rows | 2 |
| Orientation | Right Angle |
| Package Quantity | 20 |
| Packaging | Tray |
| Pitch | 0.6mm |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | 10033854 |
| Termination | Solder |
Compliance
| RoHS | Compliant |
Datasheet
Amphenol 10033854-252TSLF Datasheet
Download the complete datasheet for Amphenol 10033854-252TSLF to view detailed technical specifications.
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