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Technical Specifications
Amphenol 10061913-113CLF technical specifications.
General
| Board Thickness | 1.56mm |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Current Rating | 1.1A |
| Number of Positions | 164 |
| Package Quantity | 30 |
| Packaging | Tray |
| RoHS Compliant | Yes |
| Series | PCI Express |
| Termination | Solder |
| Voltage Rating (AC) | 300V |
Compliance
| RoHS | Compliant |
Datasheet
Amphenol 10061913-113CLF Datasheet
Download the complete datasheet for Amphenol 10061913-113CLF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.