16-position, 2-row IC socket designed for SOIC package to DIP conversion. Features brass contacts with tin plating and a 2.54mm terminal pitch. Constructed from glass and epoxy materials, it operates within a temperature range of -55°C to 105°C. Termination is via solder, with a 7.62mm row spacing and a low profile of 1.58mm height.
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Technical Specifications
Aries Electronics 16-350000-10 technical specifications.
General
| Package/Case | SOIC |
| Contact Material | Brass |
| Contact Plating | Tin |
| Height | 1.58mm |
| Lead Free | Lead Free |
| Length | 20.3mm |
| Material | Glass, Epoxy |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Number of Positions | 16 |
| Number of Rows | 2 |
| Package Quantity | 24 |
| Packaging | Rail/Tube |
| Pitch | 2.54mm |
| RoHS Compliant | No |
| Row Spacing | 7.62mm |
| Series | Correct-A-Chip® 350000 |
| Terminal Pitch | 2.54mm |
| Termination | Solder |
Compliance
| RoHS | Not Compliant |
Datasheet
Aries Electronics 16-350000-10 Datasheet
Download the complete datasheet for Aries Electronics 16-350000-10 to view detailed technical specifications.
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