White polyimide thermal interface material, 254mm x 254mm, featuring a natural thermal resistance of 0.78°C/W. This square-shaped pad offers 0.008-inch thickness and includes adhesive for secure application. Packaged in quantities of 100, it is designed for efficient heat dissipation in electronic assemblies.
Quick Jump:
Technical Specifications
Bergquist BP100-0.008-00-1010 technical specifications.
General
Color
White
Material
Polyimide
Natural Thermal Resistance
0.78°C/W
Package Quantity
100
Series
Bond-Ply® 100
Shape
Square
Thickness
0.008inch
Compliance
RoHS
Compliant
Datasheet
Bergquist BP100-0.008-00-1010 Datasheet
Download the complete datasheet for Bergquist BP100-0.008-00-1010 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
