White polyimide thermal interface material, 254mm x 254mm, featuring a natural thermal resistance of 0.78°C/W. This square-shaped pad offers 0.008-inch thickness and includes adhesive for secure application. Packaged in quantities of 100, it is designed for efficient heat dissipation in electronic assemblies.
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Technical Specifications
Bergquist BP100-0.008-00-1010 technical specifications.
General
| Color | White |
| Material | Polyimide |
| Natural Thermal Resistance | 0.78°C/W |
| Package Quantity | 100 |
| Series | Bond-Ply® 100 |
| Shape | Square |
| Thickness | 0.008inch |
Compliance
| RoHS | Compliant |
Datasheet
Bergquist BP100-0.008-00-1010 Datasheet
Download the complete datasheet for Bergquist BP100-0.008-00-1010 to view detailed technical specifications.
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