PackageSIP
MountingThrough Hole
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Technical Specifications
Capital Advanced Technologies US-4008 technical specifications.
General
| Board Thickness | 0.82mm |
| Package/Case | SIP |
| Height | 25.4mm |
| Material | Glass, Epoxy |
| Mount | Through Hole |
| Number of Positions | 8 |
| Reach SVHC Compliant | No |
| Series | 4000, UNI-SIP™ |
| Thickness | 787um |
| Width | 20.32mm |
Compliance
| RoHS | Compliant |
Datasheet
Capital Advanced Technologies US-4008 Datasheet
Download the complete datasheet for Capital Advanced Technologies US-4008 to view detailed technical specifications.
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