Product Change NoticeMicrochip

Microchip PCN CENO-01UVKE616 Pre and Post Change Summary (CCB 7907)

Summary of changes to lead frame material, lead-lock design, and DAP surface preparation for Microchip products under CCB 7907 (PCN CENO-01UVKE616).

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Overview

This Product Change Notice (PCN CENO-01UVKE616 / CCB 7907) outlines the transition from NSEB to MMT lead frames. Key modifications include a shift in lead-frame material from EFTEC-64T to A194, a change in lead-lock design from dimples to locking holes to improve moisture protection, and a DAP surface preparation change from silver (Ag) ring to bare copper (Cu).

Use Cases

Manufacturing change tracking
Quality assurance and reliability assessment
Component sourcing documentation
Moisture sensitivity level (MSL) evaluation

Topics

Microchip

PCN CENO-01UVKE616

CCB 7907

Lead Frame

EFTEC-64T

A194

Lead-Lock

DAP Surface Prep

NSEB

MMT

Referenced Parts

A194

Microchip

Lead-Frame Material A194

CENO-01UVKE616

Microchip

PCN #: CENO-01UVKE616

EFTEC-64T

Microchip

Lead-Frame Material EFTEC-64T

A194	Microchip	Lead-Frame Material A194
CENO-01UVKE616	Microchip	PCN #: CENO-01UVKE616
EFTEC-64T	Microchip	Lead-Frame Material EFTEC-64T