PackageLFBGA
MountingSurface Mount
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Technical Specifications
Digi International NET+50-BINP technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Interface | SPI, Ethernet, UART, EBI/EMI |
| Max Operating Temperature | 85°C |
| Memory Type | External Program Memory, |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 40 |
| Package Quantity | 126 |
| Packaging | Tray |
| Series | NET+ARM® |
Compliance
| RoHS | Not Compliant |
Datasheet
Digi International NET+50-BINP Datasheet
Download the complete datasheet for Digi International NET+50-BINP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.