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BFR193FH6327XTSA1

BFR193FH6327XTSA1

Description:

Trans RF BJT NPN 12V 0.08A Automotive AEC-Q101 3-Pin TSFP T/R

Manufacturer:

Infineon Technologies AG

Country of Origin:

China

Introduction date:

May 3, 2007

Last Updated Date: 27 NOV 2023

See moreRF BJT by Infineon Technologies AG

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Online version: https://www.datasheets.com/en/part-details/bfr193fh6327xtsa1-infineon-technologies-ag-47866394

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
rocketPremium
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
yesYes
Supplier Cage Codeinfo
C6489
HTSUSAinfo
8541210075
Schedule Binfo
8541210080
Taxonomy Path
Semiconductor > Diodes, Transistors and Thyristors > Bipolar Transistors > RF BJT

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Arrow Electronics

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
infolock

parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Supplier Temperature Grade
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Maximum Turn-Off Time
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Maximum Rise Time
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Maximum Emitter Cut-Off Current
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Maximum DC Collector Current Range
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Maximum Collector-Emitter Voltage Range
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Maximum Collector Cut-Off Current
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Typical Collector Efficiency
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Tradename
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Minimum Storage Temperature
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Maximum Storage Temperature
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Collector Current for VCE Saturation
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Typical Transition Frequency
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Minimum Transition Frequency
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Process Technology
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Type
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Configuration
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Number of Elements per Chip
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Maximum Collector-Emitter Voltage
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Maximum Collector Base Voltage
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Maximum Emitter Base Voltage
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Maximum DC Collector Current
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Maximum Power Dissipation
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Maximum Junction Ambient Thermal Resistance
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Maximum Junction Case Thermal Resistance
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Minimum DC Current Gain
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Minimum DC Current Gain Range
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Maximum Collector-Emitter Saturation Voltage
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Maximum Base Emitter Saturation Voltage
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Maximum Transition Frequency
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Maximum Turn-On Time
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Maximum Noise Figure
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Typical Input Capacitance
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Typical Output Capacitance
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Output Power
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Maximum Power 1dB Compression
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Operational Bias Conditions
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Typical Power Gain
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Maximum 3rd Order Intercept Point
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Minimum Operating Temperature
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Maximum Operating Temperature
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Material
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BFR193FH6327XTSA1

BFR193FH6327XTSA1

Manufacturer:Infineon Technologies AG

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