XCVU9P-2FLGB2104I

Description:	FPGA Virtex UltraScale Family 2586150 Cells 20nm Technology 0.95V 2104-Pin FCBGA
Manufacturer:	Advanced Micro Devices, Inc.
Introduction date:	Jun 19, 2013
Last Updated Date: 08 NOV 2023
See moreField Programmable Gate Arrays - FPGAs by Advanced Micro Devices, Inc.

Reference designs

Online version: https://www.datasheets.com/en/part-details/xcvu9p-2flgb2104i-advanced-micro-devices--inc--84408447

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycle

Premium

EU RoHS

Yes with Exemption

RoHS Version

2011/65/EU, 2015/863

ECCN

3A001.a.7.b

Automotive

Supplier Cage Code

6Z9Z3

HTSUSA

8542390001

Schedule B

8542390000

Taxonomy Path
Semiconductor > Programmable Devices > Programmable Logic Devices > Field Programmable Gate Arrays - FPGAs

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Datasheet

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

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Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Orientation Marking Type

Package Orientation

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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Product Line

Number of Inter Dielectric Layers

Maximum Storage Temperature

Minimum Storage Temperature

Maximum Differential I/O Pairs

Maximum I/O Performance

Maximum Distributed RAM Bits

Maximum DSP Block Frequency

Maximum MLAB Capacity

Device PCIe Hard IP Blocks

Number of Regional Clocks

Maximum LVDS Data Rate

Digital Control Impedance

Number of I/O Banks

Mega Multiply Accumulates per second

I/O Voltage

Shift Registers

Number of Global Clocks

In-System Programmability

Maximum Internal Frequency

Supplier Temperature Grade

Reprogrammability Support

Tolerant Configuration Interface Voltage

Temperature Flag

Typical Supply Current

Maximum Power Dissipation

Copy Protection

Device Logic Gates

Device Logic Units

Tradename

JTAG Support

Maximum Supply Current

Family Name

Maximum Number of User I/Os

Number of Registers

RAM Bits

Device Logic Cells

Number of Look-up Table Input

Device System Gates

Ethernet MACs

Minimum Operating Supply Voltage

Number of Multipliers

Typical Operating Supply Voltage

Processor Blocks

Transceiver Blocks

Maximum Operating Supply Voltage

Transceiver Speed

Program Memory Type

Dedicated DSP

PCI Blocks

Device Number of DLLs/PLLs

Total Number of Block RAM

Maximum Propagation Delay Time

Giga Multiply Accumulates per Second

Maximum Number of SERDES Channels

Speed Grade

Differential I/O Standards Supported

Single-Ended I/O Standards Supported

External Memory Interface

Supported IP Core

Supported IP Core Manufacture

Minimum Operating Temperature

Maximum Operating Temperature

Programmability

Process Technology

Reference designs

Unlock inspiration and guidance with our collection of reference designs. Explore practical implementations showcasing the capabilities of the electronic component. Accelerate your development process and create efficient solutions with detailed documentation and schematics.