Search Results for &quot; 70V7519S133BFI &quot;

SRAM Chip Sync Dual 3.3V 9M-Bit 256K x 36 15ns/4.2ns 208-Pin CABGA

Volume Production

Access Time: 25ns

Address Bus Width: 18b

Package/Case: LFBGA

Density: 9Mb

Integrated Device Technology

Dual-Port SRAM 262144 Words, 2 Ports, 133 MHz, 3.3V, Industrial Temperature

TFBGA, BGA208,17X17,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

70V7519S133BFI8

SRAM Chip Sync Dual 3.3V 9M-Bit 256K x 36 15ns/4.2ns 208-Pin CABGA T/R

Volume Production

Access Time: 15ns

Address Bus Width: 18b

Package/Case: LFBGA

Density: 9Mb

Search Results for "70V7519S133BFI"

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SRAM Chip Sync Dual 3.3V 9M-Bit 256K x 36 15ns/4.2ns 208-Pin CABGA

Volume Production

Access Time: 25ns

Address Bus Width: 18b

Package/Case: LFBGA

Density: 9Mb

Integrated Device Technology

Dual-Port SRAM 262144 Words, 2 Ports, 133 MHz, 3.3V, Industrial Temperature

TFBGA, BGA208,17X17,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

70V7519S133BFI8

SRAM Chip Sync Dual 3.3V 9M-Bit 256K x 36 15ns/4.2ns 208-Pin CABGA T/R