Search Results for &quot; 72T1855L6-7BB &quot;

4K x 18 / 8K x 9 TeraSync FIFO, 2.5V

End of Life

Access Time: 3.8ns

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Integrated Device Technology

PBGA-144, Tray

BGA-144

Obsolete

Max Operating Temperature: 70

Number of Terminals: 144

Min Operating Temperature: 0

Terminal Position: BOTTOM

72T1855L6-7BBG

FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 4K x 18/8K x 9 144-Pin BGA

Unknown

Package/Case: BGA

RoHS Compliant: Yes

Search Results for "72T1855L6-7BB"

Filters

4K x 18 / 8K x 9 TeraSync FIFO, 2.5V

End of Life

Access Time: 3.8ns

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Integrated Device Technology

PBGA-144, Tray

BGA-144

Obsolete

Max Operating Temperature: 70

Number of Terminals: 144

Min Operating Temperature: 0

Terminal Position: BOTTOM

72T1855L6-7BBG

FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 4K x 18/8K x 9 144-Pin BGA