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128K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Density: 4.5Mb

128K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Density: 4.5Mb