
FDI IRD-LPC1768-DEV technical specifications.
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Interface | I2C, SPI, RS-232, USB, Ethernet |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Operating Supply Voltage | 5V |
| Packaging | Bulk |
| RoHS | Compliant |
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