The GS881Z32BGD-150IV is an 18-bit memory device packaged in a Flip Chip Ball Grid Array (FBGA) with 4 ports. It operates within a temperature range of -40°C to 85°C. The device is packaged in a tray and is compliant with RoHS regulations. It does not have radiation hardening capabilities and has a density of 9 megabits.
PackageFBGA
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Technical Specifications
GSI GS881Z32BGD-150IV technical specifications.
General
| Address Bus Width | 18b |
| Package/Case | FBGA |
| Density | 9Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 4 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
GSI GS881Z32BGD-150IV Datasheet
Download the complete datasheet for GSI GS881Z32BGD-150IV to view detailed technical specifications.
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