The GS88236BD-200I is a memory device from GSI with an 18-bit address bus width and a density of 9 megabytes. It is packaged in a flip-chip ball grid array (FBGA) and is available in a tray packaging. The device operates within a temperature range of -40°C to 85°C. It is not designed for radiation hardening and is not compliant with RoHS regulations.
PackageFBGA
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Technical Specifications
GSI GS88236BD-200I technical specifications.
General
| Address Bus Width | 18b |
| Package/Case | FBGA |
| Density | 9Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 4 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
GSI GS88236BD-200I Datasheet
Download the complete datasheet for GSI GS88236BD-200I to view detailed technical specifications.
No datasheet is available for this part.