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Technical Specifications
Harwin H2101B01 technical specifications.
General
| Board Thickness | 1.6mm |
| Contact Material | Brass |
| Contact Plating | Tin |
| Insulation | Non-Insulated |
| Material | Brass |
| Mount | Through Hole |
| Mounting Hole Diameter | 1.87mm |
| Outside Diameter | 2.39mm |
| Package Quantity | 2000 |
| Packaging | Bulk |
| Plating | Tin |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Termination | PC Pin |
Compliance
| RoHS | Compliant |
Datasheet
Harwin H2101B01 Datasheet
Download the complete datasheet for Harwin H2101B01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.