Hynix
H55M1G62MFP-E3
H55M1G62MFP-E3, DDR SDRAM Memory 1Gbit, 16M x 16 bit, 333MHz, 5ns, 1.7 1.95 V, 60-pin, FBGA
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Hynix H55M1G62MFP-E3 technical specifications.
General
Access Time-Max
5ns
Address Bus Width
14b
Package/Case
FBGA
Data Bus Width
16b
Height
0.61mm
Length
12mm
Max Operating Temperature
85°C
Min Operating Temperature
-25°C
Max Supply Voltage
1.95V
Memory Size
1Gb
Min Supply Voltage
1.7V
Mount
Surface Mount
Width
8mm
Compliance
RoHS
Compliant
Datasheet
Hynix H55M1G62MFP-E3 Datasheet
Download the complete datasheet for Hynix H55M1G62MFP-E3 to view detailed technical specifications.
No datasheet is available for this part.
Product Images
