Hynix
H55S1G62MFP-E3
H55S1G62MFP-E3, DDR SDRAM Memory 1 Gbit, 2 Gbit Surface Mount, 166MHz, 1.7 1.95 V, -30 +85 C
PackageFBGA
MountingSurface Mount
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Technical Specifications
Hynix H55S1G62MFP-E3 technical specifications.
General
Access Time-Max
6ns
Address Bus Width
14b
Package/Case
FBGA
Data Bus Width
16b
Height
1mm
Length
12mm
Max Operating Temperature
85°C
Min Operating Temperature
-30°C
Max Supply Voltage
1.95V
Memory Size
1Gb
Min Supply Voltage
1.7V
Mount
Surface Mount
Width
8mm
Compliance
RoHS
Compliant
Datasheet
Hynix H55S1G62MFP-E3 Datasheet
Download the complete datasheet for Hynix H55S1G62MFP-E3 to view detailed technical specifications.
No datasheet is available for this part.
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