PackageFBGA
Quick Jump:
Technical Specifications
Hynix HY27UF082G2BFPCB technical specifications.
General
Address Bus Width
29b
Package/Case
FBGA
Density
2Gb
Interface
Serial
Max Operating Temperature
70°C
Memory Type
SLC NAND,
Min Operating Temperature
0°C
Operating Supply Voltage
3.3V
Radiation Hardening
No
Compliance
RoHS
UnconfirmedNo
Datasheet
Hynix HY27UF082G2BFPCB Datasheet
Download the complete datasheet for Hynix HY27UF082G2BFPCB to view detailed technical specifications.
No datasheet is available for this part.