PackageFBGA
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Technical Specifications
Hynix HY27UF082G2BFPCB technical specifications.
General
| Address Bus Width | 29b |
| Package/Case | FBGA |
| Density | 2Gb |
| Interface | Serial |
| Max Operating Temperature | 70°C |
| Memory Type | SLC NAND, |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 3.3V |
| Radiation Hardening | No |
Compliance
| RoHS | UnconfirmedNo |
Datasheet
Hynix HY27UF082G2BFPCB Datasheet
Download the complete datasheet for Hynix HY27UF082G2BFPCB to view detailed technical specifications.
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