PackageLBGA
MountingSurface Mount
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Technical Specifications
IDT 89HPES3T3ZBBCI8 technical specifications.
General
| Package/Case | LBGA |
| Contact Plating | Tin, Lead |
| Height | 1.4mm |
| Interface | PCI Express |
| Lead Free | Contains Lead |
| Length | 13mm |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level | 3 |
| Mount | Surface Mount |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| RoHS Compliant | No |
| Series | PRECISE™ |
| Thickness | 1.4mm |
| Width | 13mm |
Compliance
| RoHS | Not Compliant |
Datasheet
IDT 89HPES3T3ZBBCI8 Datasheet
Download the complete datasheet for IDT 89HPES3T3ZBBCI8 to view detailed technical specifications.
No datasheet is available for this part.