Integrated Silicon Solution
IS42RM32160C-75BLI
512Mbit Mobile SDRAM 16Mx32 32-bit 133MHz 2.5V 90-Pin WBGA
512Mbit Mobile SDRAM chip, organized as 16Mx32, features a 32-bit data bus width and a maximum clock rate of 133 MHz. This surface-mount DRAM utilizes a 90-pin WBGA package with a 0.8mm pin pitch, measuring 13mm x 8mm x 1mm. Operating at a typical 2.5V supply voltage, it offers a maximum access time of 7ns or 5.4ns and supports 4 internal banks. Extended temperature range from -40°C to 85°C.
PackageWBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Integrated Silicon Solution IS42RM32160C-75BLI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WBGA
Lead Shape
Ball
Pin Count
90
PCB
90
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
512Mbit
Type
Mobile SDRAM
Organization
16Mx32
Data Bus Width
32bit
Maximum Clock Rate
133MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
7|5.4ns
Density in Bits
536870912bit
Address Bus Width
15bit
Maximum Operating Current
170mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.7V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1J9V2
EU RoHS
Yes
HTS Code
8542320028
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Integrated Silicon Solution IS42RM32160C-75BLI Datasheet
Download the complete datasheet for Integrated Silicon Solution IS42RM32160C-75BLI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.