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Technical Specifications
Intel AY80609007293AA SLC2P technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TPBGA
Lead Shape
Ball
Pin Count
518
PCB
518
Package Length (mm)
13.85(Max)
Package Width (mm)
13.85(Max)
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.05(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel AY80609007293AA SLC2P Datasheet
Download the complete datasheet for Intel AY80609007293AA SLC2P to view detailed technical specifications.
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