This 21-position D-Subminiature connector features a shielded design and is made with a copper alloy contact material plated with gold. It has a polymer dielectric material and is available in a bulk packaging option. The connector operates within a temperature range of -55°C to 125°C and is suitable for through hole and panel mount applications.
MountingThrough Hole, Panel
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Technical Specifications
ITT MDM-21SBSP technical specifications.
General
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Contact Type | Signal |
| Dielectric Material | Polymer |
| Features | Shielded |
| Gender | Receptacle |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole, Panel |
| Number of Contacts | 21 |
| Number of Positions | 21 |
| Number of Rows | 2 |
| Orientation | Straight |
| Packaging | Bulk |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | No |
| Series | 83513-Style Micro D Metal Shell (MDM) |
| Termination | Solder |
Compliance
| RoHS | Not CompliantNo |
Datasheet
ITT MDM-21SBSP Datasheet
Download the complete datasheet for ITT MDM-21SBSP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.