The MDM-25SSP-A30 is a D-Subminiature connector with 25 SKT contacts, suitable for panel mounting. It features a straight body orientation and a solder pot termination method. The connector has a terminal pitch of 0.64 and a maximum current rating of 3A. It is designed for use in applications requiring high-density connections.
MountingPanel Mount
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Technical Specifications
ITT MDM-25SSP-A30 technical specifications.
General
| Type | D-Subminiature |
| Contact Gender | SKT |
| Number of Contacts | 25 |
| Terminal Pitch | 0.64mm |
| Number of Rows | 2 |
| Termination Method | Solder Pot |
| Body Orientation | Straight |
| Mounting | Panel Mount |
| Number of Terminals | 25 |
| Number of Ports | 1 |
| Max Current Rating | 3A |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
ITT MDM-25SSP-A30 Datasheet
Download the complete datasheet for ITT MDM-25SSP-A30 to view detailed technical specifications.
No datasheet is available for this part.