ITT
MDM-9SBSP-TL57A174
Conn Micro D-Subminiature SKT 9 POS 1.27mm Solder ST Thru-Hole 9 Terminal 1 Port
Conn Micro D-Subminiature SKT 9 POS 1.27mm Solder ST Thru-Hole 9 Terminal 1 Port
MountingThrough Hole
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Technical Specifications
ITT MDM-9SBSP-TL57A174 technical specifications.
General
| Type | Micro D-Subminiature |
| Contact Gender | SKT |
| Number of Contacts | 9 |
| Terminal Pitch | 0.64mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Number of Terminals | 9 |
| Number of Ports | 1 |
| Max Current Rating | 3A |
Compliance
| RoHS | No |
| RoHS Version | 2011/65/EU, 2015/863 |
Datasheet
ITT MDM-9SBSP-TL57A174 Datasheet
Download the complete datasheet for ITT MDM-9SBSP-TL57A174 to view detailed technical specifications.
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