Conn Wire to Board RCP 21 POS 0.5mm Solder RA SMD
MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry FI-RE21S-HF technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 21 |
| Terminal Pitch | 0.5mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 80°C |
| Body Orientation | Right Angle |
| Mounting | Surface Mount |
| Max Current Rating | 0.8/ContactA |
| Height | 4.3mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry FI-RE21S-HF Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry FI-RE21S-HF to view detailed technical specifications.
No datasheet is available for this part.