MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry FI-SE30P-HFE technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 30 |
| Terminal Pitch | 1.25mm |
| Number of Rows | 1 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 80°C |
| Body Orientation | Right Angle |
| Mounting | Surface Mount |
| Max Current Rating | 1A |
| Height | 2.11mm |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry FI-SE30P-HFE Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry FI-SE30P-HFE to view detailed technical specifications.
No datasheet is available for this part.