Japan Aviation Electronics Industry
FI-W26P-HFE
Conn Board to Board HDR 26 POS 0.625mm Solder RA SMD T/R
MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry FI-W26P-HFE technical specifications.
General
| Terminal Pitch (mm) | 0.625 |
| Body Orientation | Right Angle |
| Mounting | Surface Mount |
| Number of Rows | 2 |
| Product Length (mm) | 19.85 |
| Product Depth (mm) | 5.4 |
| Product Height (mm) | 3.7 |
| Type | Board to Board |
| Gender | HDR |
| Number of Contacts | 26 |
| Termination Method | Solder |
Compliance
| Cage Code | S4549 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Japan Aviation Electronics Industry FI-W26P-HFE Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry FI-W26P-HFE to view detailed technical specifications.
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