Japan Aviation Electronics Industry
WB3M200VD2R1000
Conn Board to Board PL 200 POS 0.5mm Solder ST SMD T/R
Conn Board to Board PL 200 POS 0.5mm Solder ST SMD T/R
MountingSurface Mount
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Technical Specifications
Japan Aviation Electronics Industry WB3M200VD2R1000 technical specifications.
General
| Terminal Pitch (mm) | 0.5 |
| Body Orientation | Straight |
| Mounting | Surface Mount |
| Product Length (mm) | 56.7 |
| Product Depth (mm) | 7.1 |
| Product Height (mm) | 4.7 |
| Type | Board to Board |
| Gender | PL |
| Number of Contacts | 200 |
| Termination Method | Solder |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Current Rating | 0.5A |
Compliance
| Cage Code | S4549 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU |
Datasheet
Japan Aviation Electronics Industry WB3M200VD2R1000 Datasheet
Download the complete datasheet for Japan Aviation Electronics Industry WB3M200VD2R1000 to view detailed technical specifications.
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