PackageDIP Module
MountingThrough Hole
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Technical Specifications
Lite-On LTS-6316E technical specifications.
General
Package Family Name
DIM
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
11
PCB
11
Package Length (mm)
25
Package Width (mm)
18
Package Height (mm)
8.5
Seated Plane Height (mm)
8.5
Pin Pitch (mm)
2.54
Mounting
Through Hole
Type
Module
Color
Red Orange
Number of Digits
1
Configuration
Common Cathode
Digit Size
0.59in
Min Operating Temperature
-35°C
Max Operating Temperature
85°C
Intensity
2400ucd
Maximum Forward Current
25mA
Maximum Reverse Current
100uA
Viewing Area Height
15mm
Viewing Area Length
9mm
Compliance
EU RoHS
Yes with Exemption
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lite-On LTS-6316E Datasheet
Download the complete datasheet for Lite-On LTS-6316E to view detailed technical specifications.
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