8-position through-hole socket for SOIC packages. Features solder termination for secure connections. Designed for general interconnect applications.
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| Package/Case | SOIC |
| Number of Positions | 8 |
| RoHS Compliant | No |
| RoHS | Not Compliant |
Download the complete datasheet for Logical Systems PA-SOD3SM18-08 to view detailed technical specifications.
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