PackageDIP
MountingThrough Hole
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Technical Specifications
Microchip U2100B-MY technical specifications.
General
Package/Case
DIP
Max Operating Temperature
100°C
Min Operating Temperature
0°C
Mount
Through Hole
Number of Circuits
1
Package Quantity
2800
Packaging
Rail/Tube
PLL
No
Radiation Hardening
No
Compliance
RoHS
Compliant
Datasheet
Microchip U2100B-MY Datasheet
Download the complete datasheet for Microchip U2100B-MY to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.