256MB SDRAM module, 168-pin UDIMM, operating at 133 MHz with a 64-bit data bus width. Features 8 x 256M bit TSOP chips, organized as 32Mx64 (32Mx8 chip configuration). This unbuffered dual in-line memory module utilizes a non-lead-frame SMT package with a 3.3V typical operating supply voltage (3V-3.6V range). Suitable for socket mounting, it offers a CAS latency of 3 and operates within a temperature range of 0°C to 70°C.
PackageUDIMM
MountingSocket
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Technical Specifications
Microchip W3DG6335V75D2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
UDIMM
Package Description
Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
168
PCB
168
Package Length (mm)
133.48(Max)
Package Width (mm)
2.54(Max)
Package Height (mm)
30.48(Max)
Mounting
Socket
Main Category
DRAM Module
Total Density
256Mbyte
Module Type
168DIMM
Maximum Clock Rate
133MHz
Chip Density
256Mbit
Subcategory
SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
32Mx64
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
880mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
32Mx8
ECC Support
No
CAS Latency
3
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip W3DG6335V75D2 Datasheet
Download the complete datasheet for Microchip W3DG6335V75D2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.