64Mbyte SDRAM DRAM Module, 168-pin UDIMM, operating at up to 100 MHz with a 64-bit data bus width. Features an 8Mx64 organization utilizing 64M bit TSOP chips, configured as 4Mx16. Operates from a 3V to 3.6V supply, with a typical voltage of 3.3V and a maximum current draw of 540 mA. Designed for socket mounting with a non-lead-frame SMT package, measuring 133.48mm (Max) in length, 3.81mm (Max) in width, and 25.4mm in height. Supports a CAS Latency of 2 and operates across a temperature range of -40°C to 85°C.
PackageUDIMM
MountingSocket
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Technical Specifications
Microchip W3DG648V10D2I technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
UDIMM
Package Description
Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
168
PCB
168
Package Length (mm)
133.48(Max)
Package Width (mm)
3.81(Max)
Package Height (mm)
25.4
Mounting
Socket
Main Category
DRAM Module
Total Density
64Mbyte
Module Type
168DIMM
Maximum Clock Rate
100MHz
Chip Density
64Mbit
Subcategory
SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
8Mx64
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
540mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Chip Configuration
4Mx16
ECC Support
No
CAS Latency
2
Compliance
Cage Code
60991
HTS Code
8473301140
Schedule B
8473300002
ECCN
4A994.a
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Microchip W3DG648V10D2I Datasheet
Download the complete datasheet for Microchip W3DG648V10D2I to view detailed technical specifications.
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