MICROCHIP

W3EG6432S202D4I

Datasheet

Microchip

W3EG6432S202D4I

Name: W3EG6432S202D4I Microchip
Brand: Microchip
SKU: W3EG6432S202D4I

DRAM Module 256MB DDR SDRAM 200-Pin USODIMM 200MHz

256Mbyte DDR SDRAM DRAM Module, 200-pin USODIMM, 200 MHz clock rate, 0.75 ns access time, 64-bit data bus width, and 2 CAS latency. Features 8 x 256M bit TSOP chips organized as 32Mx64 (32Mx8 chip configuration). Operates with a 2.5V supply voltage (2.3V-2.7V range) and has a maximum operating current of 2800 mA. Designed for socket mounting with a non-lead-frame SMT basic package type, measuring 67.56mm (max) length, 3.81mm (max) width, and 31.75mm height. Supports a temperature range of -40°C to 85°C.

PackageUSODIMM

MountingSocket

Quick Jump:

Technical Specifications

Microchip W3EG6432S202D4I technical specifications.

General

Basic Package Type	Non-Lead-Frame SMT
Package Family Name	DIM
Package/Case	USODIMM
Package Description	Unbuffered Small Outline Dual In Line Memory Module
Lead Shape	No Lead
Pin Count	200
PCB	200
Package Length (mm)	67.56(Max)
Package Width (mm)	3.81(Max)
Package Height (mm)	31.75
Mounting	Socket
Main Category	DRAM Module
Total Density	256Mbyte
Module Type	200SODIMM
Maximum Access Time	0.75ns
Maximum Clock Rate	200MHz
Chip Density	256Mbit
Subcategory	DDR SDRAM
Data Bus Width	64bit
Number of Chip per Module	8
Organization	32Mx64
Chip Package Type	TSOP
Typical Operating Supply Voltage	2.5V
Maximum Operating Current	2800mA
Min Operating Supply Voltage	2.3V
Max Operating Supply Voltage	2.7V
Min Operating Temperature	-40°C
Max Operating Temperature	85°C
Chip Configuration	32Mx8
ECC Support	No
CAS Latency	2

Compliance

Cage Code	60991
EU RoHS	No
HTS Code	8473301140
Schedule B	8473300002
ECCN	4A994.a
Automotive	No
AEC Qualified	No
PPAP	No
RoHS Versions	2011/65/EU, 2015/863

Datasheet

This datasheet cannot be embedded due to technical restrictions.

View Datasheet Download PDF