256Mbyte DDR SDRAM general purpose memory module, 200-pin USODIMM package. Features 266 MHz maximum clock rate, 0.75 ns maximum access time, and 64-bit data bus width. Organized as 32Mx64 with 8 chips per module, each 256M bit TSOP package. Operates with a 2.3V to 2.7V supply voltage and supports a CAS latency of 2. Suitable for socket mounting with a package measuring 67.56mm (Max) length and 3.81mm (Max) width.
PackageUSODIMM
MountingSocket
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Technical Specifications
Microchip W3EG6432S262D4I technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.56(Max) |
| Package Width (mm) | 3.81(Max) |
| Package Height (mm) | 31.75 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 256Mbyte |
| Module Type | 200SODIMM |
| Maximum Access Time | 0.75ns |
| Maximum Clock Rate | 266MHz |
| Chip Density | 256Mbit |
| Subcategory | DDR SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 8 |
| Organization | 32Mx64 |
| Chip Package Type | TSOP |
| Typical Operating Supply Voltage | 2.5V |
| Maximum Operating Current | 2800mA |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 32Mx8 |
| ECC Support | No |
| CAS Latency | 2 |
Compliance
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | 4A994.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip W3EG6432S262D4I Datasheet
Download the complete datasheet for Microchip W3EG6432S262D4I to view detailed technical specifications.
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