512Mbyte SDRAM DRAM Module, 144SODIMM, featuring 64Mx64 organization with 8 chips per module. This unbuffered small outline dual in-line memory module offers a 64-bit data bus width and a maximum clock rate of 133 MHz with a 5.4 ns maximum access time. Operating at 3.3V, it utilizes TSOP chip package type and supports a CAS latency of 3. The non-lead-frame SMT component is designed for socket mounting and operates within a temperature range of -40°C to 85°C.
PackageUSODIMM
MountingSocket
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Technical Specifications
Microchip WED3DG6466V75AD1I technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
USODIMM
Package Description
Unbuffered Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
144
PCB
144
Package Length (mm)
67.72(Max)
Package Width (mm)
3.81(Max)
Package Height (mm)
27.94(Max)
Mounting
Socket
Main Category
DRAM Module
Total Density
512Mbyte
Module Type
144SODIMM
Maximum Access Time
5.4ns
Maximum Clock Rate
133MHz
Chip Density
512Mbit
Subcategory
SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
64Mx64
Chip Package Type
TSOP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
1200mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Chip Configuration
64Mx8
ECC Support
No
CAS Latency
3
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
4A994.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip WED3DG6466V75AD1I Datasheet
Download the complete datasheet for Microchip WED3DG6466V75AD1I to view detailed technical specifications.
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