64M-bit NOR Flash memory with a parallel interface, offering 4M x 16 words and an 85ns maximum access time. This surface-mount component features a 48-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.75mm pin pitch, measuring 10.5mm x 6.39mm x 1mm. It operates at a typical 3.3V supply voltage with a maximum operating current of 18mA and supports asymmetrical, sectored architecture with a top boot block. Programming voltage ranges from 1.65V to 3.6V, with an additional 11.4V to 12.6V range. Operating temperature spans from -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M28W640ECT85ZB6E technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
48
PCB
48
Package Length (mm)
10.5
Package Width (mm)
6.39
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
18mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.65 to 3.6|11.4 to 12.6V
Timing Type
Asynchronous
Maximum Access Time
85ns
Number of Words
4M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
22bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M28W640ECT85ZB6E Datasheet
Download the complete datasheet for Micron M28W640ECT85ZB6E to view detailed technical specifications.
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