PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND16GW3B4DN6E technical specifications.
General
Access Time-Max
25us
Address Bus Width
8b
Package/Case
TSOP
Density
16Gb
Interface
Parallel
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Type
NAND,
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3V
RoHS Compliant
No
Sync/Async
Asynchronous
Word Size
8b
Compliance
RoHS
Not Compliant
Datasheet
Micron NAND16GW3B4DN6E Datasheet
Download the complete datasheet for Micron NAND16GW3B4DN6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.