PackageVFBGA
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Technical Specifications
Micron NAND256W3A0AZA6F technical specifications.
General
Address Bus Width
25b
Package/Case
VFBGA
Density
256Mb
Interface
Parallel
Max Operating Temperature
85°C
Memory Type
SLC NAND,
Min Operating Temperature
-40°C
Packaging
Tape and Reel
Radiation Hardening
No
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Micron NAND256W3A0AZA6F Datasheet
Download the complete datasheet for Micron NAND256W3A0AZA6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.